The 26th China International Optoelectronic Exposition (CIOE 2025) will be held from September 10th to the 12th at the Shenzhen World Exhibition and Convention Center.

At CIOE 2025 Booth 12B31, Ligent Technologies, Inc. will feature its latest product portfolio addressing AI & Cloud Computing, Fiber To The x (FTTx)  / Wireless, Telecom, and Data Center Interconnect (DCI) applications.

Ligent will also conduct live demonstrations of its 1.6T portfolio, including:

1.6T OSFP 2×DR4 LPO SiPh

1.6T OSFP 2×DR4 LPO MCF

1.6T OSFP 2×DR4 LRO / TRO SiPh

1.6T OSFP 2×DR4/FR4 SiPh

1.6T OSFP 2×FR4 EML

Ligent Technologies' 1.6T Product Portfolio

These implementations leverage Silicon Photonics (SiPh) and Electro-Absorption Modulated Laser (EML) architectures that support scalable connectivity for next generation data centers, telecom, and high performance compute-intensive environments.

Join Ligent Technologies at Booth 12B31 to connect with fellow innovators, explore new partnerships, and help shape the next wave of optical networking advancements.

Contact Information：

Media Contact Email: mediarelations@ligent.com

Company Official Website: https://www.ligent.com